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Dianal MB-2876
Dianal MB-2876 is a hydroxyl-functional acrylic resin that can be cured with melamine or isocyanate crosslinkers to formulate reactive hot melt adhesives. It dissolves quickly in various solvents and provides low solution viscosities.
Fulfilled By ChemPoint
- Manufacturer: Mitsubishi Chemical Group
- Product Line: Elvacite® Specialty Acrylic Resins
- Product: Elvacite® Butyl Methacrylate Resins
- Industries: Adhesives
- Authorized Countries: Canada | United States
Documents
Overview
Dianal MB-2876 is a specialty thermoplastic resin containing a relatively low concentration of hydroxyl functional groups. These hydroxyl functional groups can be used for cross-linking or reactions with isocyanates and melamines to create hot-melt adhesives. With its high solubility properties, Dianal MB-2876 can be dissolved in a wide range of solvents, giving formulators flexibility and rapid dissolution for low-viscosity systems. It helps to rapidly forms films on substrates, exhibiting excellent toughness and resistance to abrasion, chemical attack from dilute acids and bases, and discoloration due to exposure to UV light or weathering.
Specifications
Non-Volatiles, %: 99.4
Clarity: Clear in Toluene with 40% Solids
Gardner color: 1
Brookfield Viscosity @ 25°C (cP): 200–350 @ 40% Solids in Toluene
Glass Transition Temp, onset (measured): 83°C
Molecular Weight (Mw): 25,000
Acid Number (mg KOH/g Resin): 5.0
Hydroxyl number (mg KOH/g Resin): 8.0
MFI (g/10min.): 40 @ 190°C
Primary Chemistry: Acrylic
Features & Benefits
Thermoplastic acrylic resin
Hydroxyl-functional resin
Low molecular weight
High flexibility
High resistance to chemicals, weathering, and UV light
Rapid dissolution
Narrow molecular weight distribution
Problems Solved
Non-Volatiles, %: 99.4
Clarity: Clear in Toluene with 40% Solids
Gardner color: 1
Brookfield Viscosity @ 25°C (cP): 200–350 @ 40% Solids in Toluene
Glass Transition Temp, onset (measured): 83°C
Molecular Weight (Mw): 25,000
Acid Number (mg KOH/g Resin): 5.0
Hydroxyl number (mg KOH/g Resin): 8.0
MFI (g/10min.): 40 @ 190°C
Applications
Hot-melt adhesives
Related Applications
Adhesives
Related Chemistries
Adhesives
Related Functions
Adhesives
Related Technologies
Adhesives
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