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PARALOID™ TMS-2670J
Dow PARALOID™ TMS-2670J MBS impact modifier helps overcome the brittle mechanical behavior of epoxy resins and composites for various demanding applications.
Fulfilled By ChemPoint
- Manufacturer: Dow
- Product Line: Dow PARALOID™ Plastic Additives
- Product: PARALOID™ BPM Impact Modifiers
- Industries: Adhesives | Plastics
- Authorized Countries: Canada | United States
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Overview
Dow PARALOID™ TMS-2670J is a methacrylate-butylacrylate-styrene (MBS) core-shell acrylic impact modifier. PARALOID™ TMS-2670J impact modifier is supplied in free-flowing powder form to allow for easy dispersion while improving impact efficiency. This methacrylate-butylacrylate-styrene grade offers a narrow, submicron particle size with a cross-linked butadiene-styrene core and acrylic shell for optimal interaction with epoxy resins.
Dow PARALOID™ TMS-2670J impact modifier has a slight effect on the viscosity of epoxy resin polymers, allowing for improved processability and impact strength. This Dow grade provides excellent retention of the glass transition temperature, improved strength at low and room temperatures, increased elongation at break, fatigue resistance, and enhanced adhesion to metal substrates. PARALOID™ TMS-2670J improves epoxy resin toughness threefold while contributing to good fatigue resistance compared to base epoxy resin. At the same time, it reduces material waste due to fewer breakages during the formulation.
Specifications
Form: Free-flowing powder
Color: White
Odor: Sweet
Relative density (water = 1): 1.0–1.2
Water solubility: Insoluble
Volatiles (% max): <1%
Primary Chemistry: Acrylic polymer(s)
Features & Benefits
Butadiene-based core-shell structure
Easily dispersible
Highly efficient
Minimal effect on viscosity
Enhanced adhesion properties
Retention of excellent thermal properties
Retention of the glass-transition temperature
Problems Solved
Difficulties with adhesion and electrical properties
Lack of temperature and chemical resistance
Complications with dispersibility in epoxy formulations
Lack of impact strength due to epoxy's brittle nature
Applications
Structural adhesives in energy windmills, automotive, aerospace, sporting goods, and electronics
Resins for circuit board laminates, underfill, and encapsulants
Liquid resins for composites in wind energy and structural components
Protective coatings for automotive, marine, transportation, and building and construction
Related Applications
Related Chemistries
Plastics
Related End Markets
Related Functions
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