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SICOMET® D-Bonder BO500
SICOMET® D-Bonder BO500 is a high performance adhesive remover designed to dissolve cyanoacrylate adhesives effectively, ensuring precise and clean debonding in various industries.
Henkel's SICOMET® D-Bonder BO500 is specially formulated adhesivedebonding solution developed to tackle that challanges of removing cyanoacrylate adhesives. Its advanced formula ansures fast action, removing residue without damaging surfaces or substrates.
This product is suitable for industrial maintenance, repair operations, and delicate consumer applications, offering unparalleled easy of use. SICOMET® D-Bonder BO500 delivers high efficiency, especially in environments requiring precision debonding without compromising the integrity of the underlying material.
Specifications
Primary chemistry: Solvent based formulation. Appearance: Clear liquid. Compatibility: Effective on moist materials bonded with cyanoacrylate adhesives. Application method: Brush or applying directly to the affected area.
Features & Benefits
Efficient removal: Dissolves cyanoacrylate adhesives quickly and effectively. Safe on surfaces: Protects sensitive substrates during the debonding process. Fast action: Minimizes downtime with its rapid dissolution properties. Versatile application: Suitable for a wide range of industries and materials. User friendly: Easy application process with precise control. Residue-free finish: Leaves surfaces clean and ready for reuse.
Problems Solved
Removes unwanted adhesive residue from industrial components. Enables reqork of bonded parts without damaging the substrates. Reduces costs associated with replacing components due to adhesive application errors. Ensures safe and effective debonding in sensitive consumer products. Prevents surface degradation caused by traditional adhesive removal methods.
Applications
Electronics manufacturing: removal of adhesive residues from circuit boards and components. Automotive industry: Debonding trim pieces, emblems, and small automotive parts. Medical devices: Safely separates adhesive-bonded medical components during repair. Aerospace maintenance: Removes cyanoacrylate adhesives from delicate aerospace materials. Jewelry repair: Cleans up adhesive residue from metal and gemstones. Consumer electronics: Repair adhesive-bonded parts in smartphones, laptop and tablets. Industrial equipment: Maintains machinery by removing old adhesives from metal surfaces. Printing and packaging: Cleans adhesive residue from printing press components. DYI projects: Enables error correction during home repairs or crafting. Optical lenses: Removes adhesive residue from fabric during production or repair. Construction: Removes adhesive bonding errors in glass, wood, and metal applications. Marine equipment: Cleans adhesive residues from boats and underwater equipment.
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ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
Thank you
Thank you for your inquiry and interest in ChemPoint. We will respond to you shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
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