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BONDERITE® C-SO 263 Wipes
BONDERITE® C-SO 263 Wipes is a premoistened cleaning wipe recommended for the removal of adhesives, sealers, sanding dust, and general soils from bare metal sheet molding compounds. BONDERITE® C-SO 263 Wipes contains no hazardous air pollutants (HAPs) or superfund amendments and reauthorization act (SARA) reportables.
BONDERITE® C-SO 263 Wipes are industrial cleaning wipes pre-saturated with a non-chlorine solvent-based solution recommended for the cleaning and degreasing of metal solutions prior to bonding applications. Upon use, it quickly dissolves or loosens excess adhesives, sealers, sanding dust, and general soils from bare metals and painted and plastic surfaces, absorbing any residue into the wipe.
BONDERITE® C-SO 263 Wipes should be applied using nitrile gloves.
Specifications
Physical form: Wipes Temperature range: Ambient VOCs: None
Features & Benefits
Solvent-based pre-saturated cleaning wipes Removes excess sealers, adhesives, sanding dust, and general soils from bare metals and sheet molding compounds Dries in place Non-chlorine No hazardous air pollutants (HAPs)
Problems Solved
Tough to remove sealers, adhesives, sanding dust, and general soils Poor metal parts surface preparation
Applications
Clean and prepare bare metals and sheet molding compounds or E-coated surfaces
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ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
Thank you
Thank you for your inquiry and interest in ChemPoint. We will respond to you shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
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