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UCON™ Solder Assist Fluid 10
UCON™ Solder Assist 10 is a high-quality polyalkylene glycol–based solder assist fluid ideal for formulations used in printed circuit board manufacturing assembly.
UCON™ Solder Assist 10 is a water-soluble, PAG-based fluid with a good inherent thermal profile, oxidative stability, and a high flash point. This high-performance material is suitable as a component in solder reflow, flux, and fusing fluids, as well as electronic applications. It improves solder joint quality by preventing and cleaning the formation of oxides and flux residues on the surface of metals formed during the soldering process. This biodegradable chemical is formulated free of halogens, heavy metals, and other harmful compounds, making it environmentally friendly. UCON™ Solder Assist 10 has a viscosity of 280 cSt at 40°C.
The formula for UCON™ Solder Assist 10 is enhanced with performance additives for excellent thermal stability and a high flash point and delivers a low-toxicity synthetic soldering material. UCON™ Solder Assist 10 is completely soluble in water as it contains zero water-insoluble additives.
Specifications
Viscosity, cSt @ 40°C: 280 Specific gravity, 20/20°C: 1.088 Pour point, °C (°F): −15 (5) Flash point, closed cup, °C (°F): 177 (350) Flash point, open cup, °C (°F): 318 (605) Surface tension, dynes/cm: 38.7 Water solubility, 25°C: Complete Cloud point, 1% aqueous soln., °C (°F): 85 (185)
Primary Chemistry: Polyalkylene glycol
Features & Benefits
High flash and fire points Water soluble Excellent washability Oxidative stability Excellent temperature profile Low odor and low toxicity Biodegradable Low foam tendency Improved solder joint quality Extended soldering iron life Noncorrosive Nonflammable Free of halogens and heavy metals
Problems Solved
Poor rinsability or washability in solder flux or fluid Hazy or opaque solder fluid clarity Premature solder oxidation Damage from corrosion, high temperatures, or oxidation Excess solder and flux residue
Applications
UCON™ Solder Assist 10 is engineered for a variety of applications, including:
Soldering fluids, fluxes, and fusing fluids Fabricating and assembling printed circuit boards Electronic and repair applications Cleaning excess solder and flux residues from the system
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Thank you
Thank you for your inquiry and interest in ChemPoint. We will respond to you shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
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