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Thermogrip® 2109
Hot-melt adhesive designed for use on porous substrates including paper, cardboard, and wood.
Fulfilled By ChemPoint
- Manufacturer: Bostik, Inc.
- Product Line: Bostik MRO Adhesives
- Product: Thermogrip® Hot Melt Glue Sticks
- Industries: Elastomers | Facility Infrastructure | Maintenance, Repair, Overhaul | Metal Processing & Fabrication | Transportation
- Authorized Countries: United States
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Overview
Thermogrip® 2109 2109 glue stick is an economical hot-melt adhesive engineered for porous substrates including paper, cardboard, and wood products.
Specifications
Color: Tan
Size (dia. x length):
1/2" x 10"
1" x 3"
Tensile Strength/Elongation: 520 psi/200%
Softening Point: 206°F (97°C)
Specific Gravity, gms/cc: 0.95
Viscosity, cps:
@250°F (121°C) 19,800
@300°F (149°C) 7,375
@350°F (177°C) 2,700
@400°F (205°C) 1,700
Open Time: Medium (10 to 30 seconds)
Temperature Resistance: -10°F to 165°F (-23°C to 74°C)
Features & Benefits
Economical with low viscosity and quick grab ability
Very good "gunability" in stick form
Performs well at application temperatures as low as 300°F
Problems Solved
Poor Glue Stick Thermal Performance
Poor Surface Bonding
Applications
Corrugated and packaging applications.
Apply 2109 between 300°F to 400°F to many other porous substrates including wood and some foams.
Used in "stand-by" applications as backup to automated packaging systems.
Economical hot melt for wood bonding
Related Applications
Maintenance, Repair, Overhaul
Related Chemistries
Maintenance, Repair, Overhaul
Related End Markets
Elastomers
Facility Infrastructure
Maintenance, Repair, Overhaul
- Consumer Products
- Electronics
- Food & Beverage
- General Industrial
- Heavy Industry
- Personal Care
- Pulp & Paper
- Wood Products
Related Functions
Maintenance, Repair, Overhaul
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