Aculon® NanoClear® is an advanced, nonstick surface treatment for enhancing the performance of SMT stencils by providing a hydrophobic and oleophobic surface. It provides an ultrathin coating that improves paste release, enhances print quality, and boosts productivity by reducing the need for recurrent cleaning and downtime.
Aculon® NanoClear® is an ultrathin (2–4 nanometers), monolayer flux-repellent coating designed to be applied to SMT stencil aperture walls to provide a nonstick surface with hydrophobic and oleophobic properties. NanoClear® promotes paste-release efficiency and print quality of technology assemblies by reducing the variation and risk of cracks, flakes, or chips.
This best-in-class surface treatment can be applied quickly and easily to the bottom side and aperture walls of stencils in an ultrathin coat less than 5 nanometers, so as not to alter the aperture size or foil thickness of the stencil. By minimizing the need for frequent cleaning, Aculon® NanoClear® also increases printing cycles, minimizes downtime, and reduces the stencil wiping and cleaning frequency of assemblies, ultimately improving throughput and reducing cost.
Product type: Two-part cleaning wipe, nano-coating
Monolayer nonstick treatment for stencil aperture walls
Hydrophobic and oleophobic
Nonstick
Promotes paste-release efficiency
Improves process yields
Fast and easy to apply
Reduces defects
Enhanced printing
Higher yields
Less underwiping
Prolonged printing cycles from frequent cleaning needs
Cracks, flakes, or chips from thick spray coatings
NanoClear® is a premier nano-coating for SMT stencils in the electronics industry that can be used successfully across a range of applications, including but not limited to the following:
Nonstick surface for stencil aperture walls
SMT stencils
How to Apply NanoClear® Wipes?
The NanoClear® SMT stencil is provided in a dual-wipe system for optimal application and should be applied with the following steps:
1. Ensure the SMT stencil is visibly clean and degreased
2. Open Part A cleaner, and scrub the bottom of the SMT stencil for approximately 60 seconds with heavy pressure
3. Rinse with flowing deionized (DI) water until the cleaner is thoroughly removed (tap water will work, but DI is preferred)
4. Dry SMT stencil after water rinse
5. Open Part B cleaner, and scrub the bottom of the SMT stencil for approximately 60 seconds with heavy pressure
6. Dry with a clean room wipe for approximately 60 seconds, and check for water beading for accurate surface application
If you have questions about the application process, please reach out to a ChemPoint representative.
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Thank you for your inquiry and interest in ChemPoint.
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ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
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