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Designed to be a fast and versatile epoxy for structural bonding of metals, phenolic plastics, polyesters, glass, FRP, hardboards, wood, ceramics, rubber, and masonry.
Bostik® 7575-Clear is a fast and versatile epoxy for structural bonding of metals, phenolic plastics, polyesters, glass, FRP, hardboards, wood, ceramics, rubber, and masonry. Unlike conventional 5-minute epoxies, Bostik® 7575 is designed for structural bonding applications requiring a fast-setting epoxy with low shrinkage, good shock resistance, and excellent mechanical and electrical properties. It provides superior resistance to vapors, gases, water, galvanic action, petroleum fuels, and salt solutions. This unique formula also allows for exposure to moist or damp surfaces while bonding. 7575-Clear is an excellent choice for a variety of applications including potting, encapsulation, sealing electrical components, and for many quick repairs.
Pot life, per 2 oz. mixed: 5 minutes
Color (mixed after cure): Clear
Mix Ratio by Volume: 1 to 1
Mixed viscosity (cps @ 68°F): 12,000-16,000
Service Temperature Range: -60°F - 185 °F
Specific Gravity (mixed): 1.14 g/mL
Shear strength (psi):
-65°F: 900
75°F: 1,500
180°F: 300
Shear strength, steel (psi): 2,800
Compressive Strength: 10,000
T-Peel (lbs./lineal in.) @ 75°F: 2
Elongation @ Break (%): 8.0
Shore "D" hardness after cure time @ 68°F:
26 after 10 mins
68 after 30 mins
74 after 60 mins
Shore "D" hardness after full cure: 75
Impact, Izod, (ft. lbs./inch of notch): 1.0
Dielectric Strength (volts/mil.): 400
Conforms to Navy spec XWS15351 and WS09125C
Slow or Inconsistent Adhesive Curing Rates
High Shrinkage Adhesive Bonding
Poor Long Term Bonding Resistance & Stability
Potting, encapsulation, sealing electrical components
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