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BONDERITE® S-FN 213
Fine Graphite in Epoxy Resin for Lubrication & Protection of Electronic Circuit Boards, Bushings, Plastics and Ceramics.
BONDERITE® S-FN 213 (Previously known as DAG 213) is a dispersion of finely divided graphite pigment in an epoxy resin solution. Provides excellent adhesion to epoxy circuit boards, bushings, plastics and ceramics and imparts excellent wear protection.
BONDERITE® S-FN 213 can also function as a lubricant coating for a clean, dry, long-wearing and maintenance-free lubrication. Reduces overall friction of mating metal parts and risk of partial or complete seizure.
TYPICAL PROPERTIES (as cured) Color: black Sheet resistance: < 1000 ohms/sq @ 25μm (1 mil) dry film thickness Service temperature continuous: 150°C (302°F) intermittent: 260°C (500°F) Coefficient of friction: 0.114 static Salt spray resistance*: > 96 hours over zinc phosphated surface, 25 micron film thickness
Features & Benefits
Superior Adhesion Performance to many Substrate Types Remains Flexible Over Broad Temperature Range Good Release Properties and Low Coefficient of Friction High Degree of Lubricity Repeatable, Controlled Electrical Resistance Properties Minimal Pre-treatment Required
Problems Solved
Poor Surface Coverage & Adhesion Performance Inconsistent Electrical Resistance Poor Long Term Wear Protection
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ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
Thank you
Thank you for your inquiry and interest in ChemPoint. We will respond to you shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
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