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MOR-AD™
Key Applications
Paper, PP, Metal
Product Description
These solvent-free, waterborne, and polypropylene bonding adhesives are typically used for splicing paper to paper and providing excellent adhesion of polypropylene to metal substrates.
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Thank you for your inquiry and interest in ChemPoint.
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ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
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