Rilprim® P23V40 is a one-component epoxy phenolic resin primer solution recommended to be applied before coatings in order to provide excellent adhesion and superior anticorrosion protection when applied on a variety of metal substrates.
Rilprim® P23V40 is solvent-based epoxy phenolic resin solution developed for use as a coating primer for Rilsan® Fine Powders. Pre-treatment eliminates all impurities from the surface prior to coating and creates a chemical bond to provide excellent adhesion, superior anticorrosion protection, and extends the lifetime of the coating when applied on a variety of metal substrates. It is recommended for applications in contact with water above 50°C. One or more protective undercoats may be applied to obtain a higher-quality coating and provide optimum performance. Rilprim® P23V40 is easy to use and applies directly via pneumatic or electrostatic spraying techniques.
It is specially developed for compatibility with Rilsan® Fine Powders and can be applied via pneumatic or electrostatic spraying techniques. Primgreen® LAT 12035 is recommended for applications in which coatings may come in contact with water above 50°C.
Dry residue after solvent evaporation (3 hours at 115°C): 26-31%
Viscosity (AFNOR 4 at 25°C): 19-26 sec
Flash point: 23 ± 1°C
Resistivity: 300 KOhms
Presentation: Ready to use
Thickness of dry film: 10-15 microns
Drying time at 20°C: 10-15 minutes
Solvent for cleaning purposes: Methylethylcetone
Epoxy phenolic resin solution
One component product
Can be applied by pneumatic or electrostatic spray technique
High performance
Developed for compatibility with Rilsan® Fine Powders
Solvent-based
Give coatings anticorrosion protection of a variety of metal substrates
Creates a chemical bond producing strong adhesion between the substrate and Rilsan® coating
Easy to use
Eliminates all impurities on surface prior to coating
Allows for a high quality coating with optimum performance
Corrosion and damage of coatings
Poor adhesion of coatings to substates
Primer for coatings on variety of metal substrates
Recommended for application in contact with water above 50°C
Adhesion on metals
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